Spreadtrum Adopts STATS ChipPAC's Innovative Packaging for China's Smartphone Market
23 janv. 2013 04h30 HE | STATS ChipPAC
SINGAPORE 23 JANUARY 2013, UNITED STATES--(Marketwire - Jan 23, 2013) - STATS ChipPAC Ltd. ("STATS ChipPAC") (SGX-ST: STATSChP) (SGX: S24) today announced implementation of breakthrough performance...
STATS ChipPAC Ranked in Top 10 Semiconductor Manufacturing Companies by the IEEE for Its Patent Innovations
07 janv. 2013 16h00 HE | STATS ChipPAC
SINGAPORE -- 8 JANUARY 2013, UNITED STATES--(Marketwire - Jan 7, 2013) - STATS ChipPAC Ltd. ("STATS ChipPAC" or the "Company") (SGX-ST: STATSChP), a leading provider of advanced semiconductor...
STATS ChipPAC Honoured With Second Consecutive Supplier of the Year Award From Cirrus Logic
05 déc. 2012 16h00 HE | STATS ChipPAC
SINGAPORE -- 6 DECEMBER 2012, UNITED STATES--(Marketwire - Dec 5, 2012) -  STATS ChipPAC Ltd. ("STATS ChipPAC" or the "Company") (SGX-ST: STATSChP), a leading semiconductor test and...
STATS ChipPAC's Advanced eWLB Provides a Versatile Integration Platform for the 2.5D and 3D Technology Evolution
05 nov. 2012 16h00 HE | STATS ChipPAC
SINGAPORE -- 6 NOVEMBER 2012, UNITED STATES--(Marketwire - Nov 5, 2012) - STATS ChipPAC Ltd. ("STATS ChipPAC" or the "Company") (SGX-ST: STATSChP), a leading semiconductor test and advanced...
STATS ChipPAC Advances Through Silicon Via Capabilities With the Qualification of 300mm Mid-End Processing and Low Volume Manufacturing
27 août 2012 16h00 HE | STATS ChipPAC
SINGAPORE--28/08/2012, UNITED STATES--(Marketwire - Aug 27, 2012) - STATS ChipPAC Ltd. ("STATS ChipPAC" or the "Company") (SGX-ST: STATSChP), a leading semiconductor test and advanced packaging...
STATS ChipPAC Receives Intel's Preferred Quality Supplier Award
11 avr. 2012 11h55 HE | STATS ChipPAC
SINGAPORE--11/04/2012, UNITED STATES--(Marketwire - Apr 11, 2012) - STATS ChipPAC Ltd. has been recognized as one of 19 companies receiving Intel Corporation's Preferred Quality Supplier (PQS)...
STATS ChipPAC Expands Manufacturing Presence in Singapore With a New Factory
05 janv. 2012 04h00 HE | STATS ChipPAC
SINGAPORE--05/01/2012, UNITED STATES--(Marketwire - Jan 5, 2012) - STATS ChipPAC Ltd. ("STATS ChipPAC" or the "Company") (SGX-ST: STATSChP), a leading semiconductor test and advanced packaging...
STATS ChipPAC's Next-Generation Fan-Out Wafer Level Technology Platform Scales Packaging Solutions for Broader Range of Advanced Applications
05 oct. 2011 09h30 HE | STATS ChipPAC
SINGAPORE--05/10/2011, UNITED STATES--(Marketwire - Oct 5, 2011) - STATS ChipPAC Ltd. ("STATS ChipPAC" or the "Company") (SGX-ST: STATSChP), a leading semiconductor test and advanced packaging...
Through-Silicon Via Supplier ALLVIA Attains ITAR Registration
08 juil. 2011 13h10 HE | ALLVIA
SUNNYVALE, CA--(Marketwire - Jul 8, 2011) - ALLVIA, the first through-silicon via (TSV) foundry, has received official International Traffic in Arms Regulations (ITAR) registration from the U.S....
STATS ChipPAC's Fan-Out Wafer Technology Platform Delivers High Performance, Highly Integrated Solutions in a Wide Range of Package Configurations
31 mai 2011 13h30 HE | STATS ChipPAC
SINGAPORE -- 6/1/2011, UNITED STATES--(Marketwire - May 31, 2011) - STATS ChipPAC Ltd. ("STATS ChipPAC" or the "Company") (SGX-ST: STATSChP), a leading semiconductor test and advanced packaging...