Latest News and Press Releases

Want to stay updated on the latest news?

Sign into Reader Account Create Reader Account

March 06, 2012 08:30 ET | Source: STATS ChipPAC

STATS ChipPAC's Scalable 3D eWLB Solutions Deliver Performance, Height and Cost Advantages Over Substrate-Based Package-on-Package Technology

SINGAPORE--06/03/2012, UNITED STATES--(Marketwire - Mar 6, 2012) - STATS ChipPAC Ltd. ("STATS ChipPAC" or the "Company") (SGX-ST: STATSChP), a leading semiconductor test and advanced packaging...
October 05, 2011 09:30 ET | Source: STATS ChipPAC

STATS ChipPAC's Next-Generation Fan-Out Wafer Level Technology Platform Scales Packaging Solutions for Broader Range of Advanced Applications

SINGAPORE--05/10/2011, UNITED STATES--(Marketwire - Oct 5, 2011) - STATS ChipPAC Ltd. ("STATS ChipPAC" or the "Company") (SGX-ST: STATSChP), a leading semiconductor test and advanced packaging...
April 19, 2011 12:45 ET | Source: STATS ChipPAC

STATS ChipPAC Receives Intel's Preferred Quality Supplier Award

SINGAPORE -- 4/20/2011, UNITED STATES--(Marketwire - Apr 19, 2011) - STATS ChipPAC Ltd. ("STATS ChipPAC") (SGX-ST: STATSChP) has been recognised to receive Intel Corporation's Preferred Quality...
April 18, 2011 16:00 ET | Source: STATS ChipPAC

STATS ChipPAC Expands Through Silicon Via Capabilities With Mid-End Processing

SINGAPORE - 4/19/2011, UNITED STATES--(Marketwire - Apr 18, 2011) - STATS ChipPAC Ltd. ("STATS ChipPAC" or the "Company") (SGX-ST: STATSChP), a leading semiconductor test and advanced packaging...
February 15, 2011 16:00 ET | Source: STATS ChipPAC

STATS ChipPAC Launches Enhanced Flip Chip Packaging With fcCuBE(TM) Technology

SINGAPORE -- 2/16/2011, UNITED STATES--(Marketwire - February 15, 2011) - STATS ChipPAC Ltd. ("STATS ChipPAC" or the "Company") (SGX-ST: STATSChP), a leading semiconductor test and advanced packaging...
January 27, 2011 16:00 ET | Source: STATS ChipPAC

STATS ChipPAC Receives Best Supplier Award From Samsung for the Second Consecutive Year

SINGAPORE -- 1/28/2011, UNITED STATES--(Marketwire - January 27, 2011) - STATS ChipPAC Ltd. ("STATS ChipPAC" or the "Company") (SGX-ST: STATSChP) today announced that it recently received "Best...
January 17, 2011 16:00 ET | Source: STATS ChipPAC

STATS ChipPAC Expands Wafer Level Package Offering With 300mm Manufacturing in Taiwan

SINGAPORE - 1/18/2011, UNITED STATES--(Marketwire - January 17, 2011) - STATS ChipPAC Ltd. ("STATS ChipPAC" or the "Company") (SGX-ST: STATSChP), a leading semiconductor test and advanced packaging...
December 13, 2010 16:00 ET | Source: STATS ChipPAC

STATS ChipPAC Reports Over 50% Growth in Flip Chip Business With More Than 250 Million Units Shipped in 2010

SINGAPORE - 12/14/2010, UNITED STATES--(Marketwire - December 13, 2010) - STATS ChipPAC Ltd. ("STATS ChipPAC" or the "Company") (SGX-ST: STATSChP), a leading semiconductor test and advanced packaging...
September 15, 2010 00:15 ET | Source: STATS ChipPAC

STATS ChipPAC Celebrates Grand Opening of New 300mm eWLB Manufacturing Facility

SINGAPORE--9/15/2010, UNITED STATES--(Marketwire - September 15, 2010) - STATS ChipPAC Ltd. ("STATS ChipPAC" or the "Company") (SGX-ST: STATSChP) today celebrated the grand opening of its new 300mm...
August 30, 2010 17:06 ET | Source: STATS ChipPAC

STATS ChipPAC Achieves Major Milestone of Over 35 Million eWLB Units Shipped

SINGAPORE - 8/31/2010, UNITED STATES--(Marketwire - August 30, 2010) - STATS ChipPAC Ltd. ("STATS ChipPAC" or the "Company") (SGX-ST: STATSChP), a leading semiconductor test and advanced...